Publication database
Products
- Femtosecond Lasers
- CARBIDE
- PHAROS
- FLINT
- Harmonic Generators
- HG for PHAROS
- HG for CARBIDE
- HIRO
- SHBC
- Tunable Wavelength Sources
- I-OPA
- ORPHEUS
- ORPHEUS-F
- ORPHEUS-MIR
- ORPHEUS-ONE
- ORPHEUS-TWINS
- ORPHEUS-N
- ORPHEUS-PS
- OPA for Ti:Sapphire Lasers
- TOPAS-PRIME
- TOPAS-PRIME-HE
- TOPAS-TWINS
- TOPAS-SHBC-400
- TOPAS-PS-800
- OPCPA Systems
- ORPHEUS-OPCPA
- OPCPA-HE
- Spectroscopy Systems
- HARPIA
- HARPIA-TA
- HARPIA-TF
- HARPIA-MM
- CarpetView
- Microscopy Sources
- CRONUS-2P
- CRONUS-3P
- Autocorrelators
- GECO
- TIPA
Applications
- Ultrafast spectroscopy
- Transient absorption spectroscopy
- Sum-frequency spectroscopy
- 2D electronic spectroscopy
- 2D infrared spectroscopy
- Fluorescence spectroscopy
- Photoemission spectroscopy
- Transient grating spectroscopy
- Flash photolysis
- Z-scan
- Advanced microscopy
- Ultrafast electron microscopy
- Transient absorption microscopy
- Nonlinear microscopy
- High-energy and attosecond science
- THz generation
- High harmonic generation
- X-ray generation
- Laser source development
- Nonlinear optics
- OPCPA
- Laser pumping and seeding
- Pulse characterization
- Repetition rate locking
- CEP stabilization
- Micro and nanofabrication
- Photopolymerization
- Color center formation
- Volume modification
- Laser–tissue interaction
- Industrial applications
- Stent cutting
- Fiber cleaving
- Stainless steel polishing
- Selective ablation
- Milling of complex 3D structures
- High-contrast marking
- Cutting
10-million-elements-per-second printing of infrared-resonant plasmonic arrays by multiplexed laser pulses
D. Pavlov, S. Gurbatov, S. I. Kudryashov, P. A. Danilov, A. P. Porfirev et al.
Optics Letters • 2019
Plasmonic Nanolenses Produced by Cylindrical Vector Beam Printing for Sensing Applications
S. A. Syubaev, A. Y. Zhizhchenko, D. V. Pavlov, S. O. Gurbatov, E. V. Pustovalov et al.
Scientific Reports • 2019
Characterization of skeletal muscle passive mechanical properties by novel micro-force sensor and tissue micro-dissection by femtosecond laser ablation
M. Garcés‑Schröder, D. Metz, L. Hecht, R. Iyer, M. Leester‑Schädel et al.
Microelectronic Engineering • 2018
1
2