Ablation
Selective ablation of tungsten carbide.
Lithium niobate microdisks fabricated using selective ablation. (a) SEM image of a microdisk. (b) A close-up view of its edge. (c) AFM image of a microdisk wedge. (d) Optical images of microdisks with different diameters (105, 135, 155, 185, 205 µm).
Selective laser ablation is a widely utilized technique in industrial laser processing, known for its ability to achieve high processing speeds while maintaining exceptional quality in the treated area. Using femtosecond laser pulses, small sections of metal layers can be precisely removed without damaging the substrate. The process allows for adjustable depth and geometry, making it adaptable to various applications. Key advantages include rapid processing, no burning or heat-affected zones, precise positioning, superior quality, and micron-level resolution.
Example of complex surface texturing on a watch bezel.
Courtesy of Lasea.
Example of complex surface ablation on brass.
A variety of materials, including metals such as stainless steel, copper, brass, and titanium, can be laser-milled. Femtosecond lasers are essential for milling complex 3D structures, including drilling, surface structuring (e.g., hydrophobic/hydrophilic surfaces), 3D shaping (such as molds for micro-optics or stamps), engraving, polishing, or cutting metals. They are also important for indirect metal processing, as traditional milling tools made from hardened steel, PCD, and WC are often produced using femtosecond lasers.
Milling complex 3D structures into various metals with high accuracy and efficiency is no longer a challenge when using CARBIDE femtosecond lasers with BiBurst.
